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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

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Brand Name : Ziitek

Model Number : TS-TIR700-25

Certification : RoHs

Place of Origin : China

MOQ : 1000PCS

Price : 0.1-10 USD/PCS

Supply Ability : 100000pcs/day

Delivery Time : 2-3 work days

Packaging Details : 1000pcs/bag

Product name : High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

Material : Carbon Fiber Filled Silicone

Density : 2.9g/cm³

Thermal conductivity (Z Axis Direction) : 25.0W/m-K

Hardness : 75±10 /55±10 Shore 00

Application : 5G Communication Equipment

Keywords : Thermal Pad

Color : Gray

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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Feature

>Good thermal conductivity 25w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material

>Non-adhesive surface

Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>wearable devices

Typical Properties of TIR®700-25 series
Product Name TIR®700-25 Test Method
Colour Gray Visual
Construction Carbon fiber filled silicone *****
Thickness range 0.01"~0.04" (0.3~1.0 mm) 0.06"~0.20"(1.5~5.0 mm) ASTM D374
Hardness 75±10 Shore 00 55±10 Shore 00 ASTM D2240
Density 2.9g/cm3 ASTM D792
Operation Temperature -40℃~ 200℃ ******
Thermal impedance 25.0W/m-K ASTM D5470
Specific heat capacity (J/g ℃) 0.75 ASTM E1269 @25℃
Flame Rating V-0 UL94
RoHS Compliant IEC62321

Product Specification
Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)

Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)

High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Product Tags:

25w/MK Carbon Based Thermal Sheet

      

Carbon Based Thermal Pad

      

Thermal Pad For 5G Communication Equipment

      
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