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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Name: Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad
Brand: ZIITEK
Price: 1 USD

Wholesale Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad from china suppliers

Brand Name : ZIITEK

Model Number : TIF™500US Series

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 days

Packaging Details : 1000pcs/bag

Keywords : Silicon Gap Filler

Thermal conductivity : 2.6 W/m-K

Hardness : 18 Shore 00

Specific Gravity : 2.95 g/cc

Dielectric Constant : 4.3 MHz

Flame rating : 94-V0

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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

The TIF™500US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Features:

> Good thermal conductive: 2.6 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF™500US Series
Color	Violet	Visual
Construction & Compostion	Ceramic filled silicone rubber	******
Thickness range	0.020"(0.50mm)~0.200"(5.0mm)	ASTM D374
Specific Gravity	2.95 g/cc	ASTM D297
Outgassing(TML)	0.55%	ASTM C351
Hardness	18 Shore 00	ASTM 2240
Operating Temp	-40 to 160℃	******
Dielectric Breakdown Voltage(T-1.0mm)	>5500 VAC	ASTM D149
Dielectric Constant@1MHZ	4.3	ASTM D150
Volume Resistivity	4.2X10¹³" Ohm-meter	ASTM D257
Flame rating	94-V0	equivalent UL
Thermal conductivity	2.6 W/m-K	ASTM D5470

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confrming

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

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Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

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