>5W / MK UL China company supplied silicone sheets 2.0mmT,45 SHORE00 for mainboard/mother board
The TIF580-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF500-50-11S Datasheet-REV02.pdf
Features:
> Good thermal conductive: 5.0W/mK
>Thickness:2.0mmT
>RoHS compliant
>Electrically isolating
>Naturally tacky needing no further adhesive coating
>Broad range of hardnesses available
Applications:
>mainboard/mother board
>notebook
>Audio and video components
>IT infrastructure
>GPS navigation and other portable devices
>RDRAM memory modules
>Micro heat pipe thermal solutions
| Typical Properties of TIF580-50-11S |
| Color | Grey | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
| Specific Gravity | 3.15 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
| 40mils / 1.016 mm | 0.43 |
| Thichness | 2.0mmT | *** | 50mils / 1.270 mm | 0.50 |
| 60mils / 1.524 mm | 0.58 |
| Hardness | 45 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
| 80mils / 2.032 mm | 0.76 |
| Tensile Strength | 55 ps | ASTM D412 | 90mils / 2.286 mm | 0.85 |
| 100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
| 120mils / 3.048 mm | 1.07 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
| 140mils / 3.556 mm | 1.25 |
| Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
| 160mils / 4.064 mm | 1.38 |
| Volume Resistivity | 4.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
| 180mils / 4.572 mm | 1.50 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
| 200mils / 5.080 mm | 1.72 |
| Thermal conductivity | 5.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
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5W / MK UL Silicone Sheets 2.0mmT 45 SHORE00 For Mainboard / Mother Board Images
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