2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink

Product Categories

Phase Changing Materials [38]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [46]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Dongguan Ziitek Electronic Materials & Technology Ltd.

Visit Website

City: Dongguan

Province/State: Guangdong

Country/Region: China

View Contact Details

2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink

Contact Now

2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink

2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are applied to fill the air gaps between the heating ...

Product Tags:

thermally conductive filler

thermal conductivity silicone

Thermally Conductive Polymers Gap

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!